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Results of research and studies have revealed that plastics materials in mechanical components, printed circuit boards, and wiring contain the majority of PVC and BFRs currently used in Acer products. A detailed explanation is provided below:
Plastics Machine Components and Modules (such as casing and internal components)
Adding BFRs to plastics materials is a common practice done for the purpose of fortifying these materials with fire retardant and heat resistant qualities. Although mechanical components and modules in electronic products don’t directly influence product system functions, they do play a vital role in the product’s aesthetic appearance, durability, and heat conductance. Thus, more time is still needed to find alternative materials for the development of new products.
Printed Circuit Boards (PCBs)
Since most PCBs use resins, BFRs are commonly added to provide fire retardant and heat resistant properties. More time is needed to conduct safety, stability, and reliability tests on alternative technologies.
Wiring
Various kinds of wiring are used in electronics products to provide fire retardant and heat resistant, softness, malleability, and other optimal engineering qualities. PVC is commonly used and phthalate esters and other hazardous substances are often added to meet manufacturing demands. Since the substitution of this material directly influences fire safety and reliability, more time is needed to conduct safety, stability, and reliability tests.
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